AUTO-3-AXIS-AB-GLUE-DISPENSING-SYSTEM
Glue Dispensing Robot
Desktop Automatic Hot Melt Glue Dispenser with R Axis WPM-334
Specifications
- Model Number
- WPM-334
- Product Name
- Glue Dispenser with R Axis
- Working Pressure
- 4-7kgf/cm
- Operating Viscosity
- 1-1,000,000cps
- Glue Amount
- 0.01ml
- Product Material
- Aluminum alloy
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Unrivaled High-Precision and Long-Lasting Durability: Built to deliver consistent and reliable performance over extended periods. This machine utilizes aprecision valve spool at its core, ensuring accurate and repeatable dispensing volumes down to0.01ml . Incorporatinghigh-end accessories and constructed withwear and corrosion-resistant materials , this dispenser is engineered forlong working life , minimizing downtime and maximizing your return on investment. -
Expertly Crafted with Professional Technology and Stable Quality: Benefit from decades of industry expertise and meticulous craftsmanship. Built uponrich industry production experience , this machine is assembled bytechnically skilled professionals . Itstight structure ,professional polishing , and rigorous quality control processes guaranteestable and consistent quality , providing you with a reliable and dependable dispensing solution you can trust for critical electronic assembly tasks. -
Effortless Operation with Compact Size and Lightweight Design: Maximize operator comfort and streamline integration into any workspace. Thesmall size and lightweight design make this machine exceptionallyeasy to operate and handle . Its compact footprint allows for seamless integration into desktop workstations and production lines, while its lightweight nature simplifies setup and repositioning. -
Versatile Needle Compatibility for Diverse Applications: Adapt to a wide range of dispensing requirements. This machine is designed to bewidely applicable andcan be connected to all kinds of standard needles . This versatility ensures compatibility with various adhesive viscosities and application types, allowing you to handle diverse electronic component assembly tasks with a single, adaptable machine. -
Integrated R Axis for Enhanced Application Flexibility (Glue Dispenser with R Axis): Expand your dispensing capabilities with the integratedR Axis functionality. Named "Glue Dispenser with R Axis", this machine suggests the inclusion of arotational axis (R-axis) . This feature likely enablesrotational dispensing , allowing for applications such as circular patterns, dispensing around cylindrical components, or precise angular positioning of the dispensing needle. This added axis enhances the machine's versatility and allows for more complex and specialized dispensing patterns required in certain electronic assemblies.(Further clarification on the specific capabilities of the R-axis would be beneficial in a more detailed specification sheet). -
Precise Bonding, Filling, Sealing, Dripping, and Coating for Electronic Components: Engineered for the specific demands of electronic component manufacturing. This machine excels at applyingglue and other liquids with precision for a variety of crucial electronic assembly processes, including:-
Precise Bonding: Securely bonding electronic components to PCBs and housings. -
Accurate Filling: Filling gaps and cavities with adhesive for insulation and protection. -
Reliable Sealing: Creating airtight and waterproof seals for sensitive electronic devices. -
Controlled Dripping: Applying precise droplets of adhesive for micro-bonding and component attachment. -
Uniform Linear/Arc-Shaped/Circular Coating: Applying consistent coatings for protection, insulation, and environmental sealing of electronic assemblies.
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Optimized for Electronic Industry Applications: Specifically tailored to the needs of the electronic manufacturing sector. ThisDesktop Automatic Hot Melt Glue Dispensing Machine For Electronic Industry andMelt Glue Dispensing Machine For Electronic Industry are clearly targeted for applications within the electronics industry, emphasizing its suitability for the delicate and precise nature of electronic component assembly and manufacturing.
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PCB (Printed Circuit Board) Assembly: Precise bonding and encapsulation of components, application of solder paste, and conformal coating. -
Semiconductor Packaging: Chip bonding, wire bonding encapsulation, and precise adhesive application in semiconductor device manufacturing. -
Consumer Electronics Manufacturing: Bonding components in smartphones, laptops, tablets, and other consumer electronic devices. -
Automotive Electronics Assembly: Reliable adhesive application for electronic control units (ECUs), sensors, and other automotive electronic components. -
LED Lighting Manufacturing: Precise adhesive application for LED die bonding, lens attachment, and environmental sealing of LED lighting products. -
Sensor Manufacturing: Accurate and consistent adhesive application for sensor assembly and encapsulation, ensuring sensor performance and environmental protection. -
Any electronic manufacturing process requiring precise, repeatable, and reliable adhesive dispensing.












Glue Dispensing Machine WPM-334 β Demo Video
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